TECHBOND GROUP BERHAD

KLSE: 5289 (TECHBND)

Last update: 2 days ago, 7:53PM

0.285

0.00 (1.79%)

Previous Close 0.280
Open 0.285
Volume 149,600
Avg. Volume (3M) 327,875
Market Cap 216,228,176
Price / Earnings (TTM) 14.25
Price / Earnings (Forward) 6.35
Price / Sales 1.52
Price / Book 0.820
52 Weeks Range
0.265 (-7%) — 0.340 (19%)
TTM Dividend Yield 2.63%
Profit Margin 11.79%
Operating Margin (TTM) 13.16%
Diluted EPS (TTM) 0.030
Quarterly Revenue Growth (YOY) 4.40%
Quarterly Earnings Growth (YOY) 9.40%
Total Debt/Equity (MRQ) 0.43%
Current Ratio (MRQ) 13.44
Operating Cash Flow (TTM) 18.09 M
Levered Free Cash Flow (TTM) 10.29 M
Return on Assets (TTM) 5.27%
Return on Equity (TTM) 8.10%

Market Trend

Short Term Medium Term
Industry Specialty Chemicals (MY) Bearish Bearish
Specialty Chemicals (Global) Bullish Mixed
Stock TECHBND Bearish Bearish

AIStockmoo Score

0.3
Analyst Consensus 1.5
Insider Activity NA
Price Volatility 0.5
Technical Moving Averages -1.0
Technical Oscillators 0.0
Average 0.25

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TECHBND 216 M 2.63% 14.25 0.820
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SENFONG 487 M 3.33% 67.50 2.18
COMFORT 90 M - - 0.130
HEXCARE 77 M - - 0.180

Techbond Group Bhd is an investment holding company providing management services to its subsidiaries. Its segments are Industrial Adhesives & Sealants, Supporting Products and Services, and Chemicals, with the majority of revenue generated from Industrial Adhesives and Sealants. The company operates in Malaysia, Vietnam, Thailand, Indonesia, China, and other countries, with majority of revenue generated from Malaysia. It develops and manufactures water-based and hot melt adhesives, water-based and solvent-based sealants, and offers supporting products such as OEM adhesives, chemicals, repellents, cleaners, spare parts, and maintenance services. Its products include adhesives for woodworking, paper and packaging, mattresses, construction, hygiene, cigarettes, automotive, and bookbinding.

Sector Basic Materials
Industry Specialty Chemicals
Investment Style Small Value
% Held by Insiders 70.06%
52 Weeks Range
0.265 (-7%) — 0.340 (19%)
Median 0.370 (29.83%)
Total 1 Buy
Firm Date Target Price Call Price @ Call
RHB 17 Apr 2026 0.370 (29.82%) Buy 0.285

No data within this time range.

Date Type Details
03 Apr 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MADAM TAN SIEW GEAK
03 Apr 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
01 Apr 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
01 Apr 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - MR LEE SENG THYE
01 Apr 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MR LEE SENG THYE
01 Apr 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - SONICBOND SDN BHD
30 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
30 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MADAM TAN SIEW GEAK
30 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - MR LEE SENG THYE
30 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MR LEE SENG THYE
30 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - SONICBOND SDN BHD
27 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
27 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MR LEE YUEN SHIUAN
12 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - MR LEE SENG THYE
12 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MADAM TAN SIEW GEAK
12 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MR LEE SENG THYE
12 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - SONICBOND SDN BHD
12 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
09 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
09 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MADAM TAN SIEW GEAK
06 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
06 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - MR LEE SENG THYE
06 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MR LEE SENG THYE
06 Mar 2026 Announcement Changes in Sub. S-hldr's Int (Section 138 of CA 2016) - SONICBOND SDN BHD
03 Mar 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Dealings Outside Closed Period
03 Mar 2026 Announcement Changes in Director's Interest (Section 219 of CA 2016) - MADAM TAN SIEW GEAK
11 Feb 2026 Announcement Quarterly rpt on consolidated results for the financial period ended 31/12/2025
21 Jan 2026 Announcement DEALINGS IN LISTED SECURITIES (CHAPTER 14 OF LISTING REQUIREMENTS) : Intention to Deal During Closed Period
Show more
TTM Dividend Yield 2.63%
5Y Average Dividend Yield 2.63%
Payout Ratio 55.35%
Expected Next Dividend Payment Dec 2026
Ex Date Announcement Date Payment Date Details
05 Dec 2025 21 Nov 2025 24 Dec 2025 0.0075 Cash
20 Nov 2024 06 Nov 2024 06 Dec 2024 0.01 Cash
12 Jun 2024 27 May 2024 03 Jul 2024 0.005 Cash
30 Nov 2023 27 Oct 2023 15 Dec 2023 0.0075 Cash
29 Dec 2022 28 Oct 2022 17 Jan 2023 0.005 Cash
10 Sep 2021 26 Aug 2021 30 Sep 2021 0.005 Cash
21 Dec 2020 25 Nov 2020 18 Jan 2021 0.01 Cash
20 Sep 2019 03 Sep 2019 10 Oct 2019 0.02 Cash

Annual Dividend Yield

Year Annual Dividend ($) Frequency/Year Yield %
2025 0.008 1 2.42
2024 0.015 2 3.90
2023 0.013 2 3.09
2021 0.015 2 3.75
2019 0.020 1 5.03

The support, resistance and trendline levels presented has been generated by an artificial intelligence (AI) model and should be interpreted with caution.

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