Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Unisem's assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer-level CSP (chip scale packaging), flip chip, and radio frequency, analog, digital, and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing, and drop-ship services. The company has a business presence in the United States of America, which is also its key revenue generating market, Asia, and Europe.